Jacobs: Jacobs awarded CG Semi contract for engineering design of OSAT facility in Sanand


Engineering services company Jacobs on Thursday said it has been appointed by CG Semi for the engineering design of the company new Outsourced Semiconductor Assembly and Test (OSAT) facility at Sanand, Gujarat in India.

ET was the first to report on August 5 that Murugappa Group firm CG Power’s semiconductor arm CG Semi had onboarded the leading global facilities management firm to build its upcoming chip assembly plant in Sanand.

CG Semi is a joint venture between CG Power, Renesas Electronics Corporation, and Stars Microelectronics (Thailand).

Jacobs said it will serve as the engineering, procurement and construction services (EPCS) partner on the Mini Line, and engineering partner on the Main Line.

“Jacobs partnering with CG Semi on this pivotal project underscores our commitment to delivering innovative and sustainable solutions in the rapidly expanding semiconductor market in India,” Jacobs Chair and CEO Bob Pragada said in a statement. “With our extensive experience in the U.S., Europe and Asia, and proven capabilities, we are eager to contribute to the success of their new facility, helping to drive growth and technological advancement in the region.”


Pragada had told ET in an exclusive interview last month that the company was in active consultation with four of the five chip projects that had received approval from the government. With CG Power and the Tata group, however, he said Jacobs was “in a full engagement role.”

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He said the CG Semi facility was a critical packaging test and assembly partner to Renesas and said the pilot plant is in the field in construction and that the company was “still in design for the main facility” while adding that the project was progressing ‘very fast.’Jacobs said the main facility is planned to be built on more than 28 acres. It added that the OSAT facility will manufacture a variety of advanced and legacy packages for industries such as automotive, consumer, industrial and 5G.



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